BGA assembly refers to a ball grid array, a type of surface-mount packaging that is used to create and maintain integrated circuits. BGA assembly is derived from the PGA method (Pin Grid Array) which is a package that has one face covered and with pins in a grid style pattern. With PGA, the pins are used to conduct signals from an integrated circuit to the PCB, or printed circuit board that is used. BGA assembly, changes this operation slightly, as the pins are replaced with balls of solder, which stick to the bottom of the package.

When BGA assembly is referenced, it is usually in regard to a turnkey project. The phrase turnkey in this context usually means results will be immediate, as in pre-built packages sold by a company in which everything needed to perform a specific task is included. For computers and technology, this may mean a newly built computer with pre-installed software, hardware and other accessories.

BGA assembly may touch three different areas: in product development, design, manufacturing, fabrication and additional software development. A turnkey solution would be needed here, as companies would desire the entire BGA assembly process to be bundled together in an easy turnkey solution.

If you need assistance with BGA assembly contact TurnkeySolutionsNow. Turnkey Solutions can assist you in all levels of BGA assembly expertise, from the sales, customer service and business ends to the latest in cutting edge technology. The company seeks to increase profits for clients and enhance the efficiency of BGA assembly from all angles. As the expression “turn key” suggests, the company's goal is to provide a single-point access to a broad range of specialized services. If you desire a full range of options in BGA assembly then contact Turnkey Solutions for a single click solution.